Cheonan-si, South Korea

Mingu Lee


Average Co-Inventor Count = 5.0

ph-index = 1


Company Filing History:


Years Active: 2024-2025

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2 patents (USPTO):Explore Patents

Title: Innovations of Mingu Lee in Semiconductor Manufacturing

Introduction

Mingu Lee is a notable inventor based in Cheonan-si, South Korea. He has made significant contributions to the field of semiconductor manufacturing, holding 2 patents that showcase his innovative approach to chip bonding technology.

Latest Patents

Mingu Lee's latest patents include an "Apparatus for bonding chip band and method for bonding chip using the same." This invention features a chip bonding apparatus that consists of a body, a substrate conveyor for transferring substrates, a bonding head conveyor, and an alignment unit for adjusting the positions of the substrate and chip. The bonding head is equipped with a chip bonding unit designed to attach the chip to the substrate effectively.

Another significant patent is the "Semiconductor manufacturing apparatus including bonding head." This apparatus is designed to bond a substrate to a semiconductor chip. It includes a support for mounting the substrate and a bonding head that transfers the semiconductor chip onto the substrate. The bonding head features an attachment pad that adjusts its shape by modifying the air pressure in a cavity, ensuring a secure bond between the chip and substrate.

Career Highlights

Mingu Lee is currently employed at Samsung Electronics Co., Ltd., a leading company in the electronics and semiconductor industry. His work at Samsung has allowed him to develop and refine his innovative technologies, contributing to the advancement of semiconductor manufacturing processes.

Collaborations

Mingu Lee collaborates with talented coworkers, including Chulhyun Park and Kangsan Lee. Their combined expertise fosters a creative environment that drives innovation in their projects.

Conclusion

Mingu Lee's contributions to semiconductor manufacturing through his patents and work at Samsung Electronics Co., Ltd. highlight his role as a key innovator in the industry. His inventions are paving the way for advancements in chip bonding technology, showcasing the importance of innovation in modern electronics.

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