The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 05, 2024
Filed:
May. 10, 2021
Samsung Electronics Co., Ltd., Suwon-si, KR;
Mingu Lee, Cheonan-si, KR;
Chulhyun Park, Anyang-si, KR;
Kangsan Lee, Hwaseong-si, KR;
Eunhaeng Lee, Suwon-si, KR;
Euisun Choi, Seoul, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A semiconductor manufacturing apparatus configured to bond a substrate to a semiconductor chip includes a support configured to mount a substrate on a main surface of the support; and a bonding head configured to transfer the semiconductor chip to stack the semiconductor chip on the substrate and including an attachment pad configured to attach the semiconductor chip, wherein the attachment pad includes a bottom surface configured to attach the semiconductor chip; a vacuum channel extending from the bottom surface; and a cavity, and wherein the bonding head is configured to adjust a shape of the bottom surface of the attachment pad by adjusting a pressure of air in the cavity.