Minghsuan Liu

Title: Innovations by Minghsuan Liu in Electromagnetic Wave Annealing

Introduction

Minghsuan Liu is an accomplished inventor based in San Marcos, CA (US). He has made significant contributions to the field of materials science, particularly in the area of bonding substrates using advanced techniques.

Latest Patents

Minghsuan Liu holds a patent for an "Apparatus and methods to remove unbonded areas within bonded substrates using localized electromagnetic wave annealing." This innovative technology involves an electromagnetic wave irradiation apparatus designed to bond unbonded areas in a bonded pair of substrates. The method eliminates unbonded areas by inducing thermal activation through electromagnetic wave irradiation, which excites phonons or electrons. The first substrate absorbs the electromagnetic radiation, and the resulting thermal energy transfers to the interface of the bonded pair, facilitating the formation of a bond, such as a Si—O—Si bond.

Career Highlights

Minghsuan Liu is currently employed at Ostendo Technologies, Inc., where he continues to develop cutting-edge technologies. His work focuses on enhancing the efficiency and effectiveness of substrate bonding processes, which are crucial in various applications, including electronics and materials engineering.

Collaborations

Minghsuan Liu has collaborated with notable colleagues, including Hussein S El-Ghoroury and Kameshwar Yadavalli. These collaborations have contributed to the advancement of innovative solutions in their respective fields.

Conclusion

Minghsuan Liu's work in electromagnetic wave annealing represents a significant advancement in substrate bonding technology. His innovative approach has the potential to impact various industries, making him a noteworthy figure in the realm of inventions.