The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 06, 2019
Filed:
Mar. 07, 2017
Ostendo Technologies, Inc., Carlsbad, CA (US);
Hussein S. El-Ghoroury, Carlsbad, CA (US);
Minghsuan Liu, San Marcos, CA (US);
Kameshwar Yadavalli, Carlsbad, CA (US);
Weilong Tang, Carlsbad, CA (US);
Benjamin A. Haskell, Carlsbad, CA (US);
Hailong Zhou, Los Angeles, CA (US);
Ostendo Technologies, Inc., Carlsbad, CA (US);
Abstract
An electromagnetic wave irradiation apparatus and methods to bond unbonded areas in a bonded pair of substrates are disclosed. The unbonded areas between the substrates are eliminated by thermal activation in the unbonded areas induced by electromagnetic wave irradiation having a wavelength selected to effect a phonon or electron excitation. A first substrate of the bonded pair of substrates absorbs the electromagnetic radiation and a portion of a resulting thermal energy transfers to an interface of the bonded pair of substrates at the unbonded areas with sufficient flux to cause opposite sides the first and second substrates to interact and dehydrate to form a bond (e.g., Si—O—Si bond).