Xi'an, China

Mingchao Yang

This inventor holds 1 USPTO granted patent. Top assignee: Xi'an Jiaotong University. Active years: 2026.


Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Innovations of Mingchao Yang in Low-Temperature Processing Methods

Introduction

Mingchao Yang is a prominent inventor based in Xi'an, China. He has made significant contributions to the field of semiconductor processing, particularly through his innovative patent related to low-temperature processing methods. His work aims to enhance the efficiency and effectiveness of silicon carbide interfaces.

Latest Patents

Mingchao Yang holds a patent titled "Low-temperature processing method for improving 4H—SiC/SiOinterface based on supercritical oxynitride and use thereof." This patent discloses a method that includes performing standard cleaning on a silicon carbide sample, followed by dry-oxygen oxidation to grow an oxide layer. The process involves placing the sample in a supercritical chamber, controlling pressure, and injecting nitrogen-oxygen gas. The temperature is then increased from 23° C. to 500° C., maintaining this state until processing is complete. This innovative approach allows for a significant reduction in the 4H—SiC/SiOinterface state density and lowers the processing temperature.

Career Highlights

Mingchao Yang is affiliated with Xi'an Jiaotong University, where he continues to advance research in semiconductor technologies. His work has garnered attention for its practical applications in improving semiconductor device performance.

Collaborations

Mingchao Yang has collaborated with notable colleagues such as Weihua Liu and Menghua Wang. Their joint efforts contribute to the ongoing research and development in the field of semiconductor processing.

Conclusion

Mingchao Yang's innovative contributions to low-temperature processing methods represent a significant advancement in semiconductor technology. His patent not only enhances the efficiency of silicon carbide interfaces but also sets a new standard for processing temperatures in the industry.

Profile summary based on public USPTO records.
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