This inventor holds 1 USPTO granted patent and 2 published patent applications. Top assignee: Taiwan Semiconductor Manufacturing Co., Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Ming-Yun Liao and Integrated Circuit Packaging
Introduction
Ming-Yun Liao is an inventor associated with Taoyuan, Taiwan, and Taiwan Semiconductor Manufacturing Co., Ltd. His listed patent concerns integrated circuit packaging and methods for forming such packages.
Latest Patents
Liao is credited with 1 patent: “Integrated Circuit Packages and Methods.” The invention describes an integrated circuit package that may include a die with a substrate and a through via, a gap-fill layer along the substrate’s sidewall, and an isolation layer extending across the interface between those components. The isolation layer may also extend along the through via’s sidewalls. A bonding layer and bonding pad are formed over the isolation layer as part of the package structure.
Career Highlights
The available information connects Liao’s patent work with Taiwan Semiconductor Manufacturing Co., Ltd. His listed invention focuses on the structure and formation of integrated circuit packages.
Collaborations
Liao’s named coworkers include Yu-Chian Chiang and Yi-Hsiu Chen. The provided information does not specify their roles in the patent or the extent of their collaboration.
Conclusion
Ming-Yun Liao’s listed patent addresses integrated circuit package construction, including substrate isolation, through-via sidewalls, and bonding features.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile