Taipei, Taiwan

Ming Yueh Liu

This inventor holds 1 USPTO granted patent and 2 published patent applications. Top assignee: Industrial Technology Research Institute. Active years: 2006.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ming Yueh Liu. Retrieved from https://idiyas.com/inventor/ming-yueh-liu-atidekm8

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

Average Co-Inventor Count = 7.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2006

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1 patent (USPTO):Explore Patents

Title: Ming Yueh Liu - Innovator in Electromagnetic Interference Shielding

Introduction

Ming Yueh Liu is an inventor based in Taipei, Taiwan. He has made significant contributions to the field of electromagnetic interference (EMI) shielding. His innovative approach focuses on utilizing electrically-conductive foam in shielding apparatuses.

Latest Patent Applications

Ming Yueh Liu has filed a patent application for an "ELECTROMAGNETIC INTERFERENCE (EMI) SHIELDING APPARATUS INCLUDING ELECTRICALLY-CONDUCTIVE FOAM." This application discloses various exemplary embodiments of shielding apparatus or assemblies that incorporate electrically-conductive foam. Additionally, it outlines methods related to the creation of these shielding apparatuses and assemblies. The application also discusses methods for providing shielding for one or more components on a substrate.

Conclusion

Ming Yueh Liu is an innovative inventor whose work in EMI shielding demonstrates the potential of electrically-conductive materials in enhancing electronic device performance. His contributions to this field are noteworthy, and his ongoing efforts may lead to significant advancements in technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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