The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 03, 2006

Filed:

Mar. 20, 2003
Applicants:

Jung Yan Huang, Hsinchu, TW;

Chu Shu Tsai, Taipei, TW;

Choung-lii Chao, Yong-Ho, TW;

Chuan Kang Mu, Taichung, TW;

Jauh Jung Yang, Taipei, TW;

Cheng-chun Huang, Miaoli, TW;

Ming Yueh Liu, Taipei, TW;

Inventors:

Jung Yan Huang, Hsinchu, TW;

Chu Shu Tsai, Taipei, TW;

Choung-Lii Chao, Yong-Ho, TW;

Chuan Kang Mu, Taichung, TW;

Jauh Jung Yang, Taipei, TW;

Cheng-Chun Huang, Miaoli, TW;

Ming Yueh Liu, Taipei, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 59/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

A hot embossing auto-leveling apparatus which has an air-floating spherical bearing between a lower mold and a base, placed in a depression on the base, with the base housing an air inlet and an air outlet. A hot embossing auto-leveling method, comprising the steps of (1) performing an upward and downward coupling movement of the lower and upper molds; (2) adjusting the lower mold against the upper mold using the air-floating spherical bearing; (3) fixing the lower mold by under pressure in an orientation parallel to the upper mold; (4) placing a molded part on the lower mold; (5) evacuating, heating and pressurizing a working chamber; (6) cooling; and (7) opening.


Find Patent Forward Citations

Loading…