Ming-Yu Yen

Title: Innovations of Ming-Yu Yen in Semiconductor Packaging

Introduction

Ming-Yu Yen is a notable inventor based in MiaoLi County, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding two patents that showcase his innovative approach to enhancing package structures and manufacturing methods.

Latest Patents

Ming-Yu Yen's latest patents include a package structure and manufacturing method that features a semiconductor die, an encapsulant, a redistribution structure, and a through insulating via. This innovative package structure incorporates a first redistribution structure that consists of an insulating layer and a circuit layer. The semiconductor die is strategically placed on the first redistribution structure, which includes a semiconductor base, through semiconductor vias, a dielectric layer, and bonding connectors. The design ensures that the dielectric layer of the semiconductor die is bonded with the insulating layer of the first redistribution structure, while the bonding connectors are embedded in the dielectric layer and connected to the through semiconductor vias. The encapsulant is then disposed on the first redistribution structure, effectively encapsulating the semiconductor die.

Another patent by Ming-Yu Yen describes a package structure that includes a first redistribution circuit structure, a semiconductor die, a connecting film, and a second redistribution circuit structure. The first redistribution circuit structure features a dielectric structure and a routing structure, with the dielectric structure containing a trench that exposes the routing structure. The semiconductor die is placed on and electrically coupled to the first redistribution circuit structure, with the connecting film positioned in the trench, facilitating thermal coupling between the semiconductor die and the routing structure. The second redistribution circuit structure is then disposed on and electrically coupled to the semiconductor die, completing the innovative package design.

Career Highlights

Ming-Yu Yen is currently employed at Taiwan Semiconductor Manufacturing Company Limited, where he continues to push the boundaries of semiconductor technology. His work has been instrumental in advancing the efficiency and effectiveness of semiconductor packaging.

Collaborations

Ming-Yu Yen collaborates with talented coworkers, including Wei-Jhan Tsai and Sheng-Feng Weng, who contribute to the innovative projects at their company.

Conclusion

Ming-Yu Yen's contributions to semiconductor packaging through his patents reflect his dedication to innovation in the field. His work not only enhances the functionality of semiconductor devices but also sets a benchmark for future advancements in technology.