This inventor holds 1 USPTO granted patent. Top assignee: Asm Technology Singapore Pte Ltd. Active years: 2021.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2021
Title: The Innovative Contributions of Ming Yeung Wan
Introduction
Ming Yeung Wan is a notable inventor based in Hong Kong, CN. He has made significant contributions to the field of bonding technology, particularly through his innovative patent. His work exemplifies the intersection of engineering and technology, showcasing how inventive solutions can enhance manufacturing processes.
Latest Patents
Ming Yeung Wan holds a patent for a "Bonding apparatus incorporating variable force distribution." This bonding apparatus includes a holding element, holding element actuators, sensors, a controller, and bond force adjusting actuators. In use, the holding element secures an electrical component and is maneuvered by the holding element actuators in various directions to establish contact with a base member. The sensors measure the reaction forces exerted on the holding element during this contact. The controller then determines the bond forces to be applied to the holding element's actuating areas based on the measured reaction forces. The bond force adjusting actuators apply these forces during the bonding process, allowing for precise adjustments to the tilt of the electrical component relative to the base member. This innovation enhances the efficiency and accuracy of bonding processes in manufacturing.
Career Highlights
Ming Yeung Wan is currently employed at Asm Technology Singapore Pte Ltd, where he continues to develop and refine his innovative ideas. His work at this company has allowed him to collaborate with other talented professionals in the field, further advancing the technology surrounding bonding apparatuses.
Collaborations
Ming has worked alongside colleagues such as Wai Kin Cheung and Yu Fu Cheung. Their collaborative efforts contribute to the innovative environment at Asm Technology Singapore Pte Ltd, fostering advancements in bonding technology.
Conclusion
Ming Yeung Wan's contributions to bonding technology through his patent demonstrate his commitment to innovation and engineering excellence. His work not only enhances manufacturing processes but also sets a standard for future developments in the field.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile