Hong Kong, China

Ming Yeung Luke Wan

This inventor holds 1 USPTO granted patent and 1 EPO patent. Top assignee: Asmpt Singapore Pte. Ltd.. Active years: 2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ming Yeung Luke Wan. Retrieved from https://idiyas.com/inventor/ming-yeung-luke-wan-4oxvfae5

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0


Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2023

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1 patent (USPTO):Explore Patents

Title: The Innovative Contributions of Ming Yeung Luke Wan

Introduction

Ming Yeung Luke Wan is a notable inventor based in Hong Kong, CN. He has made significant contributions to the field of bonding technology, particularly with his innovative patent that enhances precision in bonding processes. His work is recognized for its practical applications in various industries.

Latest Patents

Ming Yeung Luke Wan holds a patent for a "High precision bonding apparatus comprising heater." This bonding apparatus features a bond head structure, an optical unit, and an actuator unit. The bond head structure includes a bond head collet, a connecting unit, and a look-through passage that extends through the bond head collet and the connecting unit along the central axis of the bond head structure. In operation, the bond head collet secures an electrical component that needs to be bonded to a bonding area of a base member. The optical unit is strategically positioned to inspect the electrical component through the look-through passage. The actuator unit adjusts the connecting unit based on the optical inspection, ensuring precise alignment of the electrical component with the bonding area.

Career Highlights

Ming Yeung Luke Wan is currently employed at Asmpt Singapore Pte. Ltd., where he continues to develop and refine innovative bonding technologies. His expertise in this area has made him a valuable asset to his company and the industry at large.

Collaborations

Ming has collaborated with talented coworkers, including Yu Fu Cheung and Wai Kin Cheung. Their combined efforts contribute to the advancement of bonding technology and the successful implementation of innovative solutions.

Conclusion

Ming Yeung Luke Wan's contributions to bonding technology through his patent and work at Asmpt Singapore Pte. Ltd. highlight his role as an influential inventor in the field. His innovative approach continues to pave the way for advancements in precision bonding applications.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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