This inventor holds 1 USPTO granted patent and 1 EPO patent. Top assignee: Asmpt Singapore Pte. Ltd.. Active years: 2023.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2023
Title: The Innovative Contributions of Ming Yeung Luke Wan
Introduction
Ming Yeung Luke Wan is a notable inventor based in Hong Kong, CN. He has made significant contributions to the field of bonding technology, particularly with his innovative patent that enhances precision in bonding processes. His work is recognized for its practical applications in various industries.
Latest Patents
Ming Yeung Luke Wan holds a patent for a "High precision bonding apparatus comprising heater." This bonding apparatus features a bond head structure, an optical unit, and an actuator unit. The bond head structure includes a bond head collet, a connecting unit, and a look-through passage that extends through the bond head collet and the connecting unit along the central axis of the bond head structure. In operation, the bond head collet secures an electrical component that needs to be bonded to a bonding area of a base member. The optical unit is strategically positioned to inspect the electrical component through the look-through passage. The actuator unit adjusts the connecting unit based on the optical inspection, ensuring precise alignment of the electrical component with the bonding area.
Career Highlights
Ming Yeung Luke Wan is currently employed at Asmpt Singapore Pte. Ltd., where he continues to develop and refine innovative bonding technologies. His expertise in this area has made him a valuable asset to his company and the industry at large.
Collaborations
Ming has collaborated with talented coworkers, including Yu Fu Cheung and Wai Kin Cheung. Their combined efforts contribute to the advancement of bonding technology and the successful implementation of innovative solutions.
Conclusion
Ming Yeung Luke Wan's contributions to bonding technology through his patent and work at Asmpt Singapore Pte. Ltd. highlight his role as an influential inventor in the field. His innovative approach continues to pave the way for advancements in precision bonding applications.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile