Ming-Yao Chen

Title: Innovations of Ming-Yao Chen in Optical Sensor Technology

Introduction

Ming-Yao Chen is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of optical sensor technology. His innovative work has led to the development of a unique patent that enhances the functionality of optical sensors.

Latest Patents

Ming-Yao Chen holds a patent for a technology titled "Through-substrate-via in photosensitive module." This patent describes a package that includes an optical sensor die with an optically active surface area (OASA) located on the front side of a substrate. A glass cover is positioned above the OASA and is attached to the front side of the substrate using a dam material. The invention features a through-substrate via (TSV) that extends from an opening at the back side of the substrate toward the front side. The TSV is designed with a stepped bottom surface at the front side of the substrate, providing essential access for electrical connections between the back and front sides of the substrate. Ming-Yao Chen has 1 patent to his name.

Career Highlights

Ming-Yao Chen is currently employed at Semiconductor Components Industries, LLC, where he continues to innovate in the field of semiconductor technology. His work has been instrumental in advancing optical sensor applications.

Collaborations

Ming-Yao Chen collaborates with talented individuals such as Chien-Wei Chang and Chih-Hung Tu. Their combined expertise contributes to the success of their projects and innovations.

Conclusion

Ming-Yao Chen's contributions to optical sensor technology through his patent demonstrate his commitment to innovation in the semiconductor industry. His work continues to influence advancements in this critical field.