The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 25, 2026
Filed:
Jul. 11, 2023
Applicant:
Semiconductor Components Industries, Llc, Scottsdale, AZ (US);
Inventors:
Assignee:
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Scottsdale, AZ (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10F 39/00 (2025.01); H10P 50/24 (2026.01); H10W 20/00 (2026.01); H10W 70/05 (2026.01); H10W 70/60 (2026.01); H10W 70/65 (2026.01); H10W 70/652 (2026.01); H10W 70/66 (2026.01); H10W 72/20 (2026.01); H10W 72/90 (2026.01); H10W 74/01 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10F 39/811 (2025.01); H10F 39/026 (2025.01); H10P 50/242 (2026.01); H10W 20/056 (2026.01); H10W 20/076 (2026.01); H10W 70/093 (2026.01); H10W 74/014 (2026.01); H10W 74/016 (2026.01); H10W 70/05 (2026.01); H10W 70/60 (2026.01); H10W 70/65 (2026.01); H10W 70/652 (2026.01); H10W 70/66 (2026.01); H10W 72/221 (2026.01); H10W 72/90 (2026.01); H10W 72/923 (2026.01); H10W 72/952 (2026.01); H10W 90/734 (2026.01);
Abstract
A package includes an optical sensor die. The optical sensor die has an optically active surface area (OASA) disposed on a front side of a substrate. A glass cover is disposed above the OASA and attached to the front side the substrate by a dam material. A through-substrate via (TSV) extends from an opening at a back side of the substrate toward a front side of the substrate. The TSV has a stepped bottom surface at the front side of the substrate. The TSV provides access for electrical connections between the back side of the substrate and the front side of the substrate.