Chih-Hung Tu

Title: Chih-Hung Tu: Innovator in Optical Sensor Technology

Introduction

Chih-Hung Tu is a prominent inventor based in Taoyuan City, Taiwan. He has made significant contributions to the field of optical sensor technology, particularly through his innovative patent related to through-substrate-via (TSV) in photosensitive modules. His work has implications for the advancement of optical sensors used in various applications.

Latest Patents

Chih-Hung Tu holds a patent for a technology titled "Through-substrate-via in photosensitive module." This patent describes a package that includes an optical sensor die with an optically active surface area (OASA) located on the front side of a substrate. A glass cover is positioned above the OASA and is attached to the front side of the substrate using a dam material. The TSV extends from an opening at the back side of the substrate toward the front side, featuring a stepped bottom surface at the front side. This design allows for electrical connections between the back and front sides of the substrate, enhancing the functionality of optical sensors.

Career Highlights

Chih-Hung Tu is currently employed at Semiconductor Components Industries, LLC, where he continues to develop innovative technologies in the semiconductor field. His expertise in optical sensors has positioned him as a valuable asset to his company and the industry at large.

Collaborations

Throughout his career, Chih-Hung Tu has collaborated with notable colleagues, including Ming-Yao Chen and Chien-Wei Chang. These collaborations have fostered a creative environment that encourages innovation and the development of cutting-edge technologies.

Conclusion

Chih-Hung Tu's contributions to optical sensor technology through his patent demonstrate his commitment to innovation in the semiconductor industry. His work continues to influence advancements in optical sensors, showcasing the importance of inventors in driving technological progress.