This inventor holds 2 USPTO granted patents. Top assignee: Alien Technology Corporation. Active years: 2006-2009.
Company Filing History:
Years Active: 2006-2009
Title: Innovations by Ming X Chan in High-Speed Bonding Technologies
Introduction
Ming X Chan is a notable inventor based in Milpitas, California, recognized for his contributions to the field of electronic assembly and bonding technologies. With a total of two patents to his name, Chan has made significant strides in developing methods that enhance the efficiency and reliability of electronic devices.
Latest Patents
Ming X Chan's latest patents include innovative technologies aimed at improving high-speed bonding processes. One of his patents, titled "Apparatuses and methods for high speed bonding," focuses on an RFID device that utilizes a first substrate with an antenna, coupled to a strap assembly by an adhesive material. This adhesive is designed to be thermally inert within a specific temperature range, ensuring a reliable bond. The predetermined temperature range for this adhesive is approximately 30 degrees Celsius to 85 degrees Celsius. In another embodiment, the adhesive can be treated with water or steam to minimize heat flow variation, enhancing its performance.
Another significant patent by Chan is the "Apparatus for forming an electronic assembly." This invention involves a unique apparatus for dispensing blocks in a fluid over a substrate. It features a first tube connected to a compression device, which pulsates blocks in a slurry flowing through the tube, facilitating the efficient assembly of electronic components.
Career Highlights
Ming X Chan has established himself as a key figure in the innovation landscape, particularly through his work at Alien Technology Corporation. His expertise in high-speed bonding and electronic assembly has contributed to advancements in RFID technology and other electronic applications.
Collaborations
Throughout his career, Chan has collaborated with notable colleagues, including Gordon S W Craig and Cornelius Vladimir Sutu. These partnerships have fostered a collaborative environment that encourages innovation and the development of cutting-edge technologies.
Conclusion
Ming X Chan's contributions to high-speed bonding technologies and electronic assembly demonstrate his commitment to innovation in the field. His patents reflect a deep understanding of materials and processes that enhance the reliability and efficiency of electronic devices.