The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 18, 2009
Filed:
Sep. 14, 2006
Gordon S. W. Craig, Palo Alto, CA (US);
Susan Swindlehurst, Morgan Hill, CA (US);
Randolph W. Eisenhardt, Fargo, ND (US);
Ming X. Chan, Milpitas, CA (US);
Gordon S. W. Craig, Palo Alto, CA (US);
Susan Swindlehurst, Morgan Hill, CA (US);
Randolph W. Eisenhardt, Fargo, ND (US);
Ming X. Chan, Milpitas, CA (US);
Alien Technology Corporation, Morgan Hill, CA (US);
Abstract
Apparatuses and methods for high speed bonding for an RFID device are provided. A first substrate includes an antenna and is coupled to a strap assembly by an adhesive material. The adhesive material is substantially inert thermally for a predetermined temperature range, or it otherwise lacks a heat flow variation greater than 0.05 W/g for the predetermined temperature range. Such an adhesive material provides a reliable bond. In a specific embodiment, the predetermined temperature range is about 30° Celsius to about 85° Celsius. In an alternative embodiment, the adhesive material can be exposed to water or steam to reduce its heat flow variation to less than 0.05 W/g for the temperature range.