Cupertino, CA, United States of America

Ming-Ling Yeh

This inventor holds 1 USPTO granted patent. Top assignee: Apple Inc.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ming-Ling Yeh. Retrieved from https://idiyas.com/inventor/ming-ling-yeh-o3gcmwnk

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Ming-Ling Yeh and Touch Sensor Innovation.

Introduction

Ming-Ling Yeh is an inventor associated with Cupertino, California, and Apple Inc. His patent work includes a touch sensor panel designed to reduce dimensions while supporting touch sensing and electrical connections.

Latest Patents

Yeh is named on 1 patent: “Touch Sensor Panel with Reduced Dimensions.” The invention describes a substrate and multiple conductive layers connected by vias. The first conductive layer includes touch electrodes, while the second includes a bonding region with bond pads that connect to those electrodes. Control circuitry, which can include touch-sensing circuitry, is mounted on a printed circuit. Conductive bonding material connects the printed circuit to the bond pads, with the conductive layers positioned between the circuit and the substrate.

Career Highlights

Yeh’s listed patent reflects work on compact touch-sensor construction and the integration of electrodes, conductive layers, and control circuitry. The available information associates him with Apple Inc.

Collaborations

Yeh’s listed coworker is Eric E. Gemnay. The patent description concerns a touch-sensor panel and its electrical connections; the available information does not specify the coworker’s role in the invention.

Conclusion

Ming-Ling Yeh’s patent documents an approach to reducing the dimensions of a touch sensor panel while arranging its electrodes, bonding connections, and control circuitry in an integrated structure.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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