The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 15, 2026

Filed:

Sep. 20, 2024
Applicant:

Apple Inc., Cupertino, CA (US);

Inventors:

Karan S. Jain, San Jose, CA (US);

Eric E. Gemnay, San Francisco, CA (US);

Sung Yul Chu, San Jose, CA (US);

Ming-Ling Yeh, Cupertino, CA (US);

Abhilash Goyal, Fremont, CA (US);

Jigar M. Patel, Cupertino, CA (US);

Assignee:

Apple Inc., Cupertino, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 3/044 (2006.01); G06F 3/041 (2006.01);
U.S. Cl.
CPC ...
G06F 3/0445 (2019.05); G06F 3/04144 (2019.05); G06F 3/04164 (2019.05);
Abstract

Disclosed herein is a touch sensor panel including a substrate, a plurality of conductive layers including a first conductive layer and a second conductive layer, a plurality of vias from the first conductive layer to the second conductive layer, and control circuitry mounted to a printed circuit. The control circuitry can include touch sensing circuitry. The first conductive layer can include a plurality of touch electrodes. The second conductive layer can be separated from the substrate by at least the first conductive layer and can include a bonding region with a plurality of bond pads for interconnection with the plurality of touch electrodes. The printed circuit can be separated from the substrate by at least the plurality of conductive layers and can be bonded to the plurality of bond pads by a conductive bonding material between the second conductive layer and the printed circuit.


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