Tokyo, Japan

Ming Lei

This inventor holds 4 USPTO granted patents and 1 published patent application and 3 EPO patents. Top assignees: Teraoka Seisakusho Co., Ltd., Honda Motor Co., Ltd.. Active years: 2021-2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ming Lei. Retrieved from https://idiyas.com/inventor/ming-lei-hqtl3tn3

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 4 

% Patents Active = 100.0

 

Average Co-Inventor Count = 2.8

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2021-2023

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4 patents (USPTO):Explore Patents

Title: Inventor Spotlight: Ming Lei

Introduction

Ming Lei is a notable inventor based in Tokyo, Japan, recognized for his contributions to the field of adhesive technologies. With a total of four patents to his name, Lei has been instrumental in developing innovative adhesive solutions that cater to a diverse range of applications. His expertise and inventions have made a significant impact on the industry.

Latest Patents

Ming Lei's latest patents focus on advanced adhesive sheets designed for improved functionality and performance. One of his key innovations is an adhesive sheet featuring an expandable adhesive layer on at least one side of a base. This adhesive layer is protected by a hot-melt protective layer that can incorporate various functional components such as antistatic agents and antioxidants. Notably, this design ensures that the adhesion surface is protected, minimizing potential issues like blocking and skin disorders.

Another innovative patent involves an adhesive sheet with an expandable adhesive layer containing an epoxy resin along with a polyfunctional epoxy resin and phenol resin as a curing agent. This formulation, enhanced with an imidazole-based compound and a temperature-sensitive foaming agent, results in an adhesive with remarkable properties, including fast curability and excellent heat resistance.

Career Highlights

Throughout his career, Ming Lei has worked with esteemed companies such as Teraoka Seisakusho Co., Ltd. and Honda Motor Co., Ltd. His experiences in these organizations have facilitated his development of groundbreaking adhesive technologies, showcasing his ability to merge innovative thinking with practical engineering applications.

Collaborations

Ming Lei has collaborated with distinguished professionals, including Shohei Ogino and Tadashi Yamaguchi. These partnerships have fostered a creative environment that encourages knowledge sharing and the advancement of adhesive technologies, furthering the potential of their inventions in the industry.

Conclusion

Ming Lei is a prominent figure in the realm of adhesive innovation, with his patents reflecting a commitment to advancing adhesive technology. His work continues to influence various industries, thanks to his inventive approach and collaborative spirit. As technology evolves, Lei’s contributions remain pivotal in developing effective adhesive solutions that meet modern demands.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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