Ming-Kun Weng

Title: The Innovative Contributions of Ming-Kun Weng

Introduction

Ming-Kun Weng is a prominent inventor based in Taipei, Taiwan. He has made significant contributions to the field of technology, particularly in the development of advanced LED packaging solutions. With a total of 11 patents to his name, Weng's work has had a substantial impact on the industry.

Latest Patents

Weng's latest patents include a lead frame array for carrying chips and an LED package structure with multiple chips. The lead frame array consists of several lead frames, where any four adjacent lead frames are connected by two pairs of linking bridge groups. Each linking bridge group features an inner linking bridge, a slanted linking bridge, and an outer linking bridge. Additionally, the LED package structure incorporates a lead frame formed by cutting the lead frame array. This structure includes an LED frame, a driver frame unit, a housing, LED chips, a driver chip, and a light-permeable package body. The design allows for efficient mounting and connection of the LED chips and driver chip, ensuring optimal performance.

Career Highlights

Throughout his career, Ming-Kun Weng has worked with notable companies such as Lite-On Technology Corporation and Lite-On Opto Technology (Changzhou) Co., Ltd. His experience in these organizations has allowed him to refine his skills and contribute to innovative projects in the field of optoelectronics.

Collaborations

Weng has collaborated with talented individuals in his field, including Chen-Hsiu Lin and Chia-Hao Wu. These partnerships have fostered a creative environment that has led to the development of groundbreaking technologies.

Conclusion

Ming-Kun Weng's contributions to the field of technology, particularly in LED packaging, demonstrate his innovative spirit and dedication to advancing the industry. His patents and collaborations reflect a commitment to excellence and a vision for the future of optoelectronics.