The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 08, 2016
Filed:
May. 31, 2014
Lite-on Electronics (Guangzhou) Limited, Guangzhou, CN;
Lite-on Technology Corporation, Taipei, TW;
Ming-Kun Weng, New Taipei, TW;
Meng-Sung Chou, New Taipei, TW;
LITE-ON ELECTRONICS (GUANGZHOU) LIMITED, Guangzhou, CN;
LITE-ON TECHNOLOGY CORPORATION, Taipei, TW;
Abstract
The instant disclosure relates to a flip-chip LED package module and a method of manufacturing thereof. The method of manufacturing flip-chip LED package module comprises the following steps. A plurality of LEDs is disposed on a carrier. A packaging process is forming a plurality of transparent lens corresponding to LEDs and binding each other by a wing portion. A separating process is proceeding to form a plurality of flip-chip LED structures without the carrier. A bonding process is proceeding to attach at least one flip-chip LED structure on the circuit board.