The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 09, 2016
Filed:
Apr. 17, 2015
Lite-on Opto Technology (Changzhou) Co., Ltd., Jiangsu Province, CN;
Lite-on Technology Corp., Taipei, TW;
Ming-Kun Weng, Taipei, TW;
Kuo-Ming Chiu, Taipei, TW;
Shih-Chiang Yen, Taipei, TW;
Meng-Sung Chou, Taipei, TW;
Chen-Hsiu Lin, Taipei, TW;
Lite-On Opto Technology (Changzhou) Co., Ltd., Jiangsu Province, CN;
Lite-On Technology Corp., Taipei, TW;
Abstract
An LED device includes a substrate, a number (N) of flip-chip LED die(s), an electrical conductive structure and a lens structure. The substrate has upper and lower surfaces and is formed with multiple through holes. A ratio of LED die(s) surface area to an area of the upper surface of the substrate ranges from 22.7% to 76.2%. The electrical conductive structure includes a number (N) of upper bonding pad assembly (assemblies), a number (N+1) of lower bonding pads and a number (2N) of interconnectors. Each upper bonding pad assembly includes two upper bonding pads electrically connected to the LED die(s). The interconnectors are disposed in the through holes and interconnect the upper and lower bonding pads. The lens structure covers the LED die(s).