Ming-Hui Tseng

Title: The Innovations of Ming-Hui Tseng

Introduction

Ming-Hui Tseng is a notable inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor packaging. His innovative work has led to the development of a unique semiconductor package design that enhances performance and reliability.

Latest Patents

Ming-Hui Tseng holds a patent for a semiconductor package with metal pads. This invention includes a die, a package body for the protection of the die, and a plurality of leads. The design features a metal pad formed by a partial downside surface of each lead, which is coplanar with the downside surface of the package body. Each lead has a cutting surface exposed on a corresponding lateral surface of the package body. The cutting surface is designed to avoid forming a sharp edge in the brim of the metal pad after cutting, achieved through selectively self-etching the leads or stamping to bend them.

Career Highlights

Ming-Hui Tseng is currently employed at Walsin Advanced Electronics Ltd., where he continues to innovate in semiconductor technology. His work has been instrumental in advancing the capabilities of semiconductor packages, making them more efficient and reliable.

Collaborations

Ming-Hui has collaborated with talented coworkers such as Chun-Jen Su and Chien-Tsun Lin. Their combined expertise has contributed to the success of various projects within the company.

Conclusion

Ming-Hui Tseng's contributions to semiconductor packaging demonstrate his commitment to innovation and excellence in technology. His patent for a semiconductor package with metal pads is a testament to his inventive spirit and technical skill.