Singapore, Singapore

Ming Hui Hong

This inventor holds 1 USPTO granted patent. Top assignee: Advanced Micro Devices Corporation. Active years: 2005.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ming Hui Hong. Retrieved from https://idiyas.com/inventor/ming-hui-hong-82b4g20z

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 5(Granted Patents)


Company Filing History:


Years Active: 2005

Loading Chart...
1 patent (USPTO):Explore Patents

Title: **Innovations by Inventor Ming Hui Hong in Integrated Circuit Decapping**

Introduction

Ming Hui Hong is an accomplished inventor based in Singapore, recognized for his innovative contributions in the field of integrated circuit technology. His unique approach to decapping integrated circuit packages presents a revolutionary method, emphasizing precision and efficiency within electronic manufacturing processes.

Latest Patents

Ming Hui Hong holds a patent for a "Method and apparatus for decapping integrated circuit packages." This invention details a technique that involves irradiating an integrated circuit package with laser radiation, typically utilizing UV-IR spectra of short pulse duration. The process induces ablation of the molding compound without damaging the internal structure of the IC. This method also features real-time monitoring and process control, ensuring effective removal of ablation debris. Additionally, performing the decapping in liquid promotes protection against oxidation from ambient air.

Career Highlights

Ming Hui Hong is currently working at Advanced Micro Devices Corporation, where he has made significant strides in his field. His innovative work not only focuses on enhancing the integrity of integrated circuits but also streamlines production processes, contributing to the overall efficiency of electronic assembly.

Collaborations

Throughout his career, Ming has collaborated with talented colleagues, including Yong Feng Lu and Wen Dong Song. These partnerships harness diverse expertise, fostering an environment of innovation and progress within the organization.

Conclusion

Ming Hui Hong’s contributions to integrated circuit package decapping represent a pivotal advancement in the electronics industry. His patent highlights the potential for improved manufacturing processes, showcasing his role as an influential inventor in Singapore’s technology landscape. His ongoing work at Advanced Micro Devices Corporation continues to inspire innovation that drives the future of electronics.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…