The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 12, 2005
Filed:
Jul. 10, 2002
Ming Hui Hong, Singapore, SG;
Yong Feng LU, Singapore, SG;
Wen Dong Song, Singapore, SG;
Zhihong Mai, Singapore, SG;
Kok Tong Thiam, Singapore, SG;
Chye Eng Soh, Singapore, SG;
Ming Hui Hong, Singapore, SG;
Yong Feng Lu, Singapore, SG;
Wen Dong Song, Singapore, SG;
Zhihong Mai, Singapore, SG;
Kok Tong Thiam, Singapore, SG;
Chye Eng Soh, Singapore, SG;
Advanced Micro Devices PTE Ltd., Singapore, SG;
Abstract
The invention relates to a method and apparatus for decapping integrated circuit packages. The invention involves irradiating an IC package with laser radiation, typically in the UV-IR spectra and of short pulse duration. The irradiation results in ablation of the molding compound. The invention also provides real-time monitoring and process control of the decapping process and fluid-flow removal of ablation debris. Using the invention, decapping can be performed without causing damage to the internal IC structure. Furthermore, decapping in a liquid can prevent oxidization of the molding compound by ambient air.