Kok Tong Thiam

Title: **Kok Tong Thiam: Innovator in Integrated Circuit Decapping Technology**

Introduction

Kok Tong Thiam is a distinguished inventor based in Singapore, renowned for his innovative work in the field of integrated circuit technology. With a focus on enhancing the decapping process of integrated circuit packages, Thiam has made significant strides in ensuring the integrity and reliability of electronic components.

Latest Patents

Thiam holds a notable patent titled "Method and Apparatus for Decapping Integrated Circuit Packages." This invention outlines a sophisticated method that utilizes laser radiation, specifically in the UV-IR spectra and of short pulse duration, to effectively decap integrated circuit packages. The method innovatively facilitates the ablation of the molding compound while ensuring that the internal structure of the integrated circuit remains undamaged. Furthermore, the invention allows for real-time monitoring and control of the decapping process, accompanied by a fluid-flow mechanism to remove ablation debris. Remarkably, by conducting the decapping in a liquid medium, the technology also mitigates the risk of oxidation due to exposure to ambient air.

Career Highlights

Currently, Kok Tong Thiam is affiliated with Advanced Micro Devices Corporation, a global leader in semiconductor technology. Throughout his career, Thiam has demonstrated a profound commitment to advancing electronic manufacturing processes, particularly in the areas of circuit packaging and reliability.

Collaborations

In his pursuit of innovation, Thiam has collaborated with talented colleagues, including Ming Hui Hong and Yong Feng Lu. These partnerships have not only contributed to the successful development of his patent but have also fostered a collaborative environment that promotes creativity and technological advancement within the company.

Conclusion

Kok Tong Thiam’s contributions to the integrated circuit industry exemplify the critical role inventors play in shaping technological advancements. His patented method for decapping integrated circuit packages stands testament to his innovative spirit and dedication to quality in electronic manufacturing. As technology continues to evolve, inventors like Thiam will remain at the forefront, driving progress and excellence in the field.