Taipei, Taiwan

Ming-Hsun Lee

USPTO Granted Patents = 5 

Average Co-Inventor Count = 1.9

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2020-2025

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5 patents (USPTO):Explore Patents

Title: The Innovations of Ming-Hsun Lee

Introduction

Ming-Hsun Lee is a prominent inventor based in Taipei, Taiwan. He has made significant contributions to the field of electronics, particularly in the development of circuit boards and electrochromic modules. With a total of 5 patents to his name, Lee's work showcases his innovative spirit and technical expertise.

Latest Patents

One of Lee's latest patents is titled "Circuit board having embedded electronic component and method for manufacturing the same." This invention involves a circuit board that integrates a first electronic component within a receiving cavity of a circuit substrate. The design includes electrodes that face the inner sidewall of the cavity, enhancing the functionality of the circuit board. Another notable patent is for an "Electrochromic module, camera module, and electronic device." This electrochromic module features two substrates with an electrochromic unit positioned between them, allowing for efficient connection to a power supply.

Career Highlights

Throughout his career, Ming-Hsun Lee has worked with notable companies such as Triple Win Technology (Shenzhen) Co. Ltd. and Giga-byte Technology Co., Ltd. His experience in these organizations has contributed to his development as an inventor and has allowed him to refine his skills in electronics and innovation.

Collaborations

Lee has collaborated with talented individuals in the field, including Yen-Lin Peng and Chen-en Lin. These partnerships have likely fostered a creative environment that encourages the exchange of ideas and advancements in technology.

Conclusion

Ming-Hsun Lee's contributions to the field of electronics through his patents and collaborations highlight his role as an influential inventor. His innovative designs continue to impact the industry and pave the way for future advancements.

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