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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12535720 B1

PDFFull Text
Date of Patent:
Jan. 27, 2026

Filed:

Aug. 24, 2023

Camera module having embedded electronic element and steel sheet for improved heat dissipation, and electronic device having the same

Applicant:

Triple Win Technology(shenzhen) Co.ltd., Shenzhen, CN;

Inventors:

Ming-Hsun Lee, New Taipei, TW;

Yi-Wan Wang, New Taipei, TW;

Assignee:

TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD., Shenzhen, CN;

Attorney:

ScienBiziP, P.C.

Primary Examiner:

Twyler L Haskins

Assistant Examiner:

Akshay undefined Trehan

Int. Cl.
CPC ...
G03B 17/55 (2021.01); H04N 23/00 (2023.01); H04N 23/52 (2023.01); H04N 23/54 (2023.01); H04N 23/57 (2023.01); H05K 1/02 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
G03B 17/55 (2013.01); H04N 23/00 (2023.01); H04N 23/52 (2023.01); H04N 23/54 (2023.01); H04N 23/57 (2023.01); H05K 1/021 (2013.01); H05K 7/2039 (2013.01);
Abstract

A camera module includes a circuit board, a photosensitive chip located on a first surface of the circuit board, an electronic element located on a second surface of the circuit board, and a steel sheet located on the second surface. A surface of the steel sheet facing the circuit board defines a groove for receiving the electronic element. A heat conductive paste is located on the electronic element and in contact with the steel sheet.

Find Patent Forward Citations

Lee, Ming-Hsun. (2026). Camera module having embedded electronic element and steel sheet for improved heat dissipation, and electronic device having the same (U.S. Patent No. 12535720). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12535720

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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