Company Filing History:
Years Active: 2008-2013
Title: The Innovations of Ming Hsun Lee
Introduction
Ming Hsun Lee is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 4 patents. His work focuses on enhancing the efficiency and functionality of semiconductor packages.
Latest Patents
One of his latest patents is titled "Col-based semiconductor package including electrical connections through a single layer leadframe." This invention discloses a semiconductor package that includes a leadframe, memory die, and controller die. The design allows for customized connections that facilitate electrical bonding between the memory and controller die bond pads and the contact pads of the host device, potentially omitting the need for an interposer layer. Another significant patent is "Die package with asymmetric leadframe connection." This patent describes a leadframe for a semiconductor package that features electrical leads extending from one side to the opposite side. The semiconductor die is supported on these leads, and a spacer layer is included to fortify the package and prevent exposure of the electrical leads during molding.
Career Highlights
Ming Hsun Lee has worked with prominent companies in the technology sector, including SanDisk Corporation and SanDisk Technologies Inc. His experience in these organizations has contributed to his expertise in semiconductor innovations.
Collaborations
Some of his notable coworkers include Hem P Takiar and Cheemen Yu. Their collaboration has likely played a role in advancing the projects they have worked on together.
Conclusion
Ming Hsun Lee's contributions to semiconductor technology through his patents and collaborations highlight his innovative spirit and dedication to advancing the field. His work continues to influence the development of efficient semiconductor packages.