Sandisk Technologies Inc.

Sandisk Corporation

Ming Hsun Lee

Hem P Takiar

Cheemen Yu

Chih-Chin Liao

Suresh Kumar Upadhyayula

A semiconductor package is disclosed including a leadframe, memory die and controller die, one or more of which are customized to facilitate electrical connection of the memory and controller die bond pads to the contact pads of the host device via the leadframe. By customizing one or more of the leadframe, memory die and controller die, an interposer layer normally required to connect the die in the semiconductor package with a host device may be omitted.

Col-based semiconductor package including electrical connections through a single layer leadframe

A leadframe for a semiconductor package is disclosed including electrical leads which extend from one side of the leadframe to an opposite side of the leadframe, where electrical connection may be made with the semiconductor die at the second side of the leadframe. The semiconductor die may be supported on the leads extending across the leadframe. The package may further include a spacer layer affixed to the electrical leads to fortify the semiconductor package and to prevent exposure of the electrical leads during the molding of the package.

Die package with asymmetric leadframe connection

A method of fabricating a semiconductor package, and a semiconductor package formed thereby, are disclosed. The semiconductor package may include one or more semiconductor die having die attach pads along a single side. The leadframe may include a plurality of elongated electrical leads, extending from a first side of the leadframe, beneath the die, and terminating at a second side of the leadframe adjacent to the bond pads along the single edge of the die. The leadframe may further include a dielectric spacer layer on the elongated leads. Spacing the semiconductor die from the elongated leads using the spacer layer reduces the parasitic capacitance and/or inductance of the semiconductor package formed thereby.

Growing community of inventors

Taichung, Taiwan

Ming Hsun Lee