The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 20, 2008
Filed:
Jun. 30, 2005
Ming Hsun Lee, Taichung, TW;
Chih-chin Liao, Changhua, TW;
Cheemen Yu, Madison, WI (US);
Hem Takiar, Fremont, CA (US);
Ming Hsun Lee, Taichung, TW;
Chih-Chin Liao, Changhua, TW;
Cheemen Yu, Madison, WI (US);
Hem Takiar, Fremont, CA (US);
SanDisk Corporation, Milpitas, CA (US);
Abstract
A leadframe for a semiconductor package is disclosed including electrical leads which extend from one side of the leadframe to an opposite side of the leadframe, where electrical connection may be made with the semiconductor die at the second side of the leadframe. The semiconductor die may be supported on the leads extending across the leadframe. The package may further include a spacer layer affixed to the electrical leads to fortify the semiconductor package and to prevent exposure of the electrical leads during the molding of the package.