Company Filing History:
Years Active: 2016-2023
Title: Innovations by Ming-Hsiao Ke
Introduction
Ming-Hsiao Ke is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of circuit board technology, holding a total of 2 patents. His work focuses on enhancing the efficiency and functionality of circuit board designs.
Latest Patents
Ming-Hsiao Ke's latest patents include a "Circuit board tape and joining method thereof" and a "Flexible substrate." The circuit board tape patent describes a unique design that incorporates substrate units with sprocket-hole regions, layout regions, and joining marks. This innovative design allows for the removal of defective substrate units and the division of the circuit board tape into front and rear tapes. The flexible substrate patent outlines a structure that includes a base layer, a metallic layer, a solder mask layer, and an identifying code, enhancing the functionality and identification of the substrate.
Career Highlights
Ming-Hsiao Ke is currently employed at Chipbond Technology Corporation, where he continues to develop cutting-edge technologies in the field of electronics. His work has been instrumental in advancing the capabilities of circuit board manufacturing.
Collaborations
Ming-Hsiao Ke collaborates with talented coworkers, including Yin-Chen Lin and Yi-Wen Chen, contributing to a dynamic and innovative work environment.
Conclusion
Ming-Hsiao Ke's contributions to circuit board technology through his patents and work at Chipbond Technology Corporation highlight his role as a significant inventor in the field. His innovative designs continue to influence the electronics industry.