This inventor holds 3 USPTO granted patents and 40 published patent applications. Top assignee: Taiwan Semiconductor Manufacturing Co., Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: The Innovations of Ming-Da Cheng
Introduction
Ming-Da Cheng is a prominent inventor based in Taoyuan, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His work focuses on innovative methods that enhance the performance and reliability of semiconductor devices.
Latest Patents
Ming-Da Cheng's latest patents include groundbreaking technologies. One of his patents is titled "Bump integration with redistribution layer." This method involves forming an interconnect structure over a substrate, followed by the creation of a first passivation layer and a first conductive feature. The process continues with the conformal formation of a second passivation layer and a dielectric layer, culminating in the development of a first bump via and a first conductive bump that are electrically coupled to the first conductive feature.
Another notable patent is "Package component with stepped passivation layer." This method includes forming a first conductive feature and depositing a passivation layer on its sidewall and top surface. The passivation layer is then etched to reveal the first conductive feature, and a step is formed by recessing the top surface of the passivation layer. This innovative approach enhances the functionality of semiconductor packages.
Career Highlights
Ming-Da Cheng is currently employed at Taiwan Semiconductor Manufacturing Co., Ltd., a leading company in the semiconductor industry. His work at this esteemed organization has allowed him to contribute to various advancements in semiconductor technology.
Collaborations
Ming-Da Cheng has collaborated with notable colleagues, including Tzy-Kuang Lee and Song-Bor Lee. These collaborations have fostered an environment of innovation and have led to the development of cutting-edge technologies in the semiconductor field.
Conclusion
Ming-Da Cheng's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor. His innovative methods continue to shape the future of semiconductor devices, showcasing the importance of creativity and research in this dynamic field.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile