Changhua, Taiwan

Ming-Chung Chian

This inventor holds 1 USPTO granted patent. Top assignee: Winbond Electronics Corporation. Active years: 2011.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ming-Chung Chian. Retrieved from https://idiyas.com/inventor/ming-chung-chian

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2011

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1 patent (USPTO):Explore Patents

Title: Innovator Spotlight: Ming-Chung Chian

Introduction: Ming-Chung Chian, an accomplished inventor based in Changhua County, Taiwan, has made significant contributions to the field of semiconductor technology. With a keen focus on advancing electronic components, he holds a patent that highlights his innovative approach to semiconductor structures.

Latest Patents: Chian's notable patent centers around a semiconductor structure designed to enhance performance and reliability. This invention includes a substrate, an insulating layer, a composite pad structure, a passivation layer, and a bump. The circuit structure is strategically disposed on the substrate, with the insulating layer covering it and featuring a first opening that reveals the circuit. The composite pad structure consists of multiple layers—first conductive, barrier, and second conductive—sequentially arranged to form a robust connection. This innovative design aims to improve electrical connectivity and performance in semiconductor applications.

Career Highlights: Ming-Chung Chian is associated with Winbond Electronics Corporation, a leading company in semiconductor production. His work there emphasizes the importance of innovation in enhancing electronic devices' capabilities. Chian's dedication to research and development has positioned him as a key player in this rapidly evolving industry.

Collaborations: Throughout his career, Chian has collaborated with talented colleagues, including Tsan-Yao Cheng and Li-Cheng Lin. These partnerships reflect a shared commitment to advancing technology and developing new solutions within the semiconductor sector.

Conclusion: Ming-Chung Chian's contributions to the field of semiconductors through his patent highlight his innovative spirit and technical expertise. As he continues to push the boundaries of semiconductor technology at Winbond Electronics Corporation, Chian remains a prominent figure in shaping the future of electronics. His work serves as an inspiration to upcoming inventors and a testament to the importance of innovation in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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