Guangdong, China

Ming-Chih Chan

This inventor holds 1 USPTO granted patent. Top assignees: Hon Hai Precision Industry Co., Ltd., Hong-Fu Jin Precision Industry (Shenzhen) Co., Ltd.. Active years: 2009.


Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2009

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1 patent (USPTO):Explore Patents

Title: The Innovative Contributions of Ming-Chih Chan

Introduction

Ming-Chih Chan is a notable inventor based in Guangdong, China. He has made significant contributions to the field of connector technology, particularly with his innovative designs that enhance functionality and reliability. His work is characterized by a focus on solving common issues in connector applications.

Latest Patents

Ming-Chih Chan holds a patent for a multi-layered connector. This invention includes a first sub-connector and a second sub-connector, with the first sub-connector featuring a first elongated body. The second sub-connector consists of a second elongated body and two side arms that extend upwardly from opposite ends. These side arms define slide grooves that face each other, allowing for the reception of the first sub-connector. Additionally, the multi-layered connector incorporates glue points that connect the two elongated bodies, effectively avoiding solder bridges and solder cracks. This innovation represents a significant advancement in connector design.

Career Highlights

Throughout his career, Ming-Chih Chan has worked with prominent companies in the technology sector. Notably, he has been associated with Hong-Fu Jin Precision Industry (Shenzhen) Co., Ltd. and Hon Hai Precision Industry Co., Ltd. His experience in these organizations has contributed to his expertise in developing cutting-edge connector solutions.

Collaborations

Ming-Chih Chan has collaborated with talented individuals in his field, including Qing Cai and Chih-Chuan Chen. These partnerships have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Ming-Chih Chan's contributions to connector technology through his patent for a multi-layered connector demonstrate his commitment to innovation. His work not only addresses existing challenges but also paves the way for future advancements in the industry.

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