The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7497741 B1

PDF
Full Text
Expired
Date of Patent:
Mar. 03, 2009

Filed:

May. 25, 2007
Applicants:

Qing Cai, Guangdong, CN;

Chih-chuan Chen, Guangdong, CN;

Ming-chih Chan, Guangdong, CN;

Xiao-qin Jiang, Guangdong, CN;

Inventors:

Qing Cai, Guangdong, CN;

Chih-Chuan Chen, Guangdong, CN;

Ming-Chih Chan, Guangdong, CN;

Xiao-Qin Jiang, Guangdong, CN;

Assignees:

Hong Fu Jin Precision Industry (Shen Zhen) Co., Ltd., Longhua Town, Bao'an District, Shenzhen, Quangdong Province, unknown;

Hon Hai Precision Industry Co., Ltd., Tu-Cheng, Taipei Hsien, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 12/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A multi-layered connector is disclosed. The multi-layered connector includes a first sub-connector and a second sub-connector. The first sub-connector includes a first elongated body. The second sub-connector includes a second elongated body, and two side arms elongated upwardly from opposite ends of the second elongated body. The side arms define slide grooves faced to each other for receiving the first sub-connector. The multi-layered connector further includes glue points that connect the first elongated body and the second elongated body. The multi-layered connector avoids solder bridges and solder cracks.


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