Portland, OR, United States of America

Ming-Chen Chang


Average Co-Inventor Count = 4.5

ph-index = 1


Company Filing History:


Years Active: 2022-2023

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3 patents (USPTO):Explore Patents

Title: Innovations by Inventor Ming-Chen Chang

Introduction

Ming-Chen Chang is a notable inventor based in Portland, OR (US). He has made significant contributions to the field of microprocessor thermal solutions. With a total of 3 patents, his work focuses on improving the efficiency and performance of electronic devices.

Latest Patents

One of his latest patents is titled "Mechanism combining fastener captivation and assembly tilt control for microprocessor thermal solutions." This invention involves a microprocessor heat sink fastener assembly that includes a base to couple to a heat sink, a retention nut, and a retention clip. The design allows for effective engagement with a latching structure, enhancing the assembly's functionality.

Another significant patent is "All-inclusive CPU carrier that enables automation and tool-free operation at low cost while improving thermal performance." This patent describes a carrier assembly that includes a socket on a package substrate and a carrier made of transparent material. The assembly is designed to facilitate the alignment and coupling of electronic devices, ultimately improving thermal management.

Career Highlights

Ming-Chen Chang is currently employed at Intel Corporation, where he continues to innovate and develop new technologies. His work at Intel has positioned him as a key contributor to advancements in microprocessor design and thermal solutions.

Collaborations

Ming-Chen has collaborated with talented coworkers such as Mustafa H Haswarey and Divya Swamy Bandaru. These collaborations have further enriched his work and contributed to the success of various projects.

Conclusion

Ming-Chen Chang's innovative patents and contributions to the field of microprocessor thermal solutions highlight his expertise and dedication as an inventor. His work continues to influence the technology landscape, making significant strides in improving electronic device performance.

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