Wugu, Taiwan

Ming-Chang Liu

This inventor holds 1 USPTO granted patent. Top assignee: Cpumate Inc.. Active years: 2008.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ming-Chang Liu. Retrieved from https://idiyas.com/inventor/ming-chang-liu-atquyo71

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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Average Co-Inventor Count = 4.0

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Company Filing History:


Years Active: 2008

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1 patent (USPTO):Explore Patents

Title: The Innovations of Ming-Chang Liu

Introduction

Ming-Chang Liu is a notable inventor based in Wugu, Taiwan. He has made significant contributions to the field of thermal interface materials, showcasing his expertise through his innovative patent.

Latest Patents

Ming-Chang Liu holds a patent for a thermal interface material compound and the method of fabricating the same. This high thermal conductivity thermal interface material compound consists of 53% by weight of polyethylene glycol, 42% by weight of silicon carbide, and 5% by weight of lithium ions. The fabrication method involves several steps, including blending the compound in a container, mixing it with a rolling machine, and using a vacuum pump to eliminate air bubbles, resulting in a high-quality thermal interface material.

Career Highlights

Ming-Chang Liu is currently employed at Cpumate Inc., where he continues to develop innovative solutions in thermal management. His work has positioned him as a key figure in the industry, contributing to advancements in material science.

Collaborations

Ming-Chang Liu collaborates with talented coworkers such as Kuo-Len Lin and Tien-Chih Tseng. Their combined expertise fosters a creative environment that drives innovation within their projects.

Conclusion

Ming-Chang Liu's contributions to thermal interface materials exemplify his dedication to innovation and excellence in engineering. His patent and ongoing work at Cpumate Inc. highlight his role as a significant inventor in the field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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