The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 04, 2008
Filed:
Sep. 08, 2006
Kuo-len Lin, Wugu Township, Taipei County, TW;
Tien-chih Tseng, Wugu Township, Taipei County, TW;
Ming-chang Liu, Wugu Township, Taipei County, TW;
Wen-jung Liu, Wugu Township, Taipei County, TW;
Kuo-Len Lin, Wugu Township, Taipei County, TW;
Tien-Chih Tseng, Wugu Township, Taipei County, TW;
Ming-Chang Liu, Wugu Township, Taipei County, TW;
Wen-Jung Liu, Wugu Township, Taipei County, TW;
Cpumate Inc., Taipei, TW;
Abstract
A high thermal conductivity thermal interface material compound includes 53% by weight of polyethylene glycol, 42% by weight of silicon carbide, and 5% by weight of lithium ions. The method of fabricating the thermal interface material includes the steps of: filling the above-described compound in a container and blending them to form aggregative compound by a blender; mixing the compound by a rolling machine to disperse the aggregative compound and filling the compound to another container; blending the compound and breaking the air bubble generated thereof, and pumping the air out of the container by a vacuum pump at the same time, to fabricate the high thermal conductivity thermal interface material compound without air bubbles.