Company Filing History:
Years Active: 2009-2013
Title: Minfan Pai: Innovator in Microelectromechanical Systems
Introduction
Minfan Pai is a notable inventor based in Los Altos, California. He has made significant contributions to the field of microelectromechanical systems (MEMS), holding a total of 2 patents. His work focuses on innovative methods for packaging and fabricating MEMS devices, which are crucial for various applications in technology.
Latest Patents
Minfan Pai's latest patents include groundbreaking methods of packaging microelectromechanical resonators. These methods involve forming an isolation trench in a capping substrate, which is filled with an electrically insulating material. This process allows for the bonding of the capping substrate to a device substrate that includes the microelectromechanical resonator. Additionally, he has developed a vacuum wafer-level packaging method for silicon-on-insulator MEMS devices. This method includes forming trenches in the active layer of a substrate to electrically isolate regions, ensuring the effective operation of MEMS devices.
Career Highlights
Throughout his career, Minfan Pai has worked with prominent companies in the technology sector. He has been associated with Integrated Device Technology, Inc. and Discera, Inc., where he has contributed to advancements in MEMS technology. His expertise in this field has positioned him as a valuable asset in the development of innovative solutions.
Collaborations
Minfan Pai has collaborated with talented individuals such as Kuolung Lei and Wanling Pan. These collaborations have further enhanced his work and contributed to the success of his projects.
Conclusion
Minfan Pai's contributions to the field of microelectromechanical systems are noteworthy. His innovative patents and career achievements reflect his dedication to advancing technology. His work continues to influence the development of MEMS devices, showcasing the importance of innovation in this field.