Integrated Device Technology, Inc.

Discera, Inc.

Minfan Pai

Kuolung Lei

Wanling Pan

Methods of forming packaged microelectromechanical resonators include forming a first isolation trench in a first surface of a capping substrate, with the first isolation trench encircling a first portion of the capping substrate. The first isolation trench is filled with an electrically insulating material. The first surface of the capping substrate is bonded to a device substrate, which includes the microelectromechanical resonator and at least a first electrically conductive line connected to the microelectromechanical resonator. A second surface of the capping substrate is planarized for a sufficient duration to thereby expose the electrically insulating material and the first portion of the capping substrate encircled by the first isolation trench. The exposed first portion of the capping substrate is selectively etched to thereby define a through-substrate opening therein, which exposes a first portion of the first electrically conductive line. At least a portion of the through-substrate opening is filled with an electrically conductive through-substrate via, which is electrically connected to the first portion of the first electrically conductive line.

Methods of packaging microelectromechanical resonators

A device and method for fabricating the device is disclosed. The device includes a substrate having an active layer disposed on a sacrificial layer. A trench is formed in the active layer to electrically isolate first and second regions in the active layer, and a non-conductive material is deposited on the substrate such that the non-conductive material fills the trench to form a substantially planar surface for support of further components of the device. In some cases, the non-conductive material fills only a portion of the trench sufficient to form the substantially planar surface. The non-conductive material may include silicon nitride.

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Los Altos, CA, United States of America

Minfan Pai