Min Su Park

Title: Min Su Park: Innovator in Semiconductor Packaging

Introduction

Min Su Park is a notable inventor based in Yongin-si, South Korea. He has made significant contributions to the field of semiconductor technology, particularly in the area of packaging solutions. His innovative approach has led to the development of a unique semiconductor package that enhances performance and reliability.

Latest Patents

Min Su Park holds a patent for a semiconductor package using core material for reverse reflow. This invention includes a first bump pad on a first substrate and a second bump pad on a second substrate. A core material for reverse reflow is positioned between the first and second bump pads, with a solder member forming a solder layer on this core material. The design ensures that the diameters of the bump pads are at least 1.1 times greater than the diameter of the core material, which includes a core and two metal layers. This innovative design improves the efficiency and effectiveness of semiconductor packaging.

Career Highlights

Min Su Park is currently employed at Mk Electron Co., Ltd., where he continues to push the boundaries of semiconductor technology. His work has been instrumental in advancing the company's product offerings and enhancing their competitive edge in the market.

Collaborations

Min Su Park collaborates with talented colleagues, including Jae Yeol Son and Jeong Tak Moon. Their combined expertise fosters a creative environment that drives innovation and leads to groundbreaking developments in semiconductor technology.

Conclusion

Min Su Park is a distinguished inventor whose contributions to semiconductor packaging are noteworthy. His innovative patent reflects his commitment to advancing technology in this critical field. His work at Mk Electron Co., Ltd. and collaborations with skilled professionals further enhance his impact on the industry.