The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 09, 2023
Filed:
May. 18, 2021
MK Electron Co., Ltd., Yongin-si, KR;
Jae Yeol Son, Yongin-si, KR;
Jeong Tak Moon, Suwon-si, KR;
Jae Hun Song, Yongin-si, KR;
Young Woo Lee, Yongin-si, KR;
Seul Gi Lee, Yongin-si, KR;
Min Su Park, Yongin-si, KR;
Hui Joong Kim, Seoul, KR;
MK ELECTRON CO., LTD., Gyeonggi-Do, KR;
Abstract
Provided is a semiconductor package including a first bump pad on a first substrate, a second bump pad on a second substrate, a core material for reverse reflow between the first bump pad and the second bump pad, and a solder member forming a solder layer on the core material for reverse reflow. The solder member is in contact with the first bump pad and the second bump pad. Each of a first diameter of the first bump pad and a second diameter of the second bump pad is at least about 1.1 times greater than a third diameter of the core material for reverse reflow. The core material for reverse reflow includes a core, a first metal layer directly coated on the core, and a second metal layer directly coated on the first metal layer.