Jae Hun Song

Title: Innovations of Jae Hun Song

Introduction

Jae Hun Song is a notable inventor based in Yongin-si, South Korea. He has made significant contributions to the field of electronics through his innovative patents. With a total of two patents to his name, his work focuses on improving electronic device manufacturing processes.

Latest Patents

One of Jae Hun Song's latest patents is a lead-free solder alloy and method of manufacturing electronic devices using the same. This lead-free solder alloy includes bismuth (Bi) in a content range of 56 wt % to 57.5 wt %, indium (In) in a content range of 0.05 wt % to 1.0 wt %, with the balance being tin (Sn) and unavoidable impurities. This innovation allows for bonding with enhanced ductility and thermal shock reliability, while maintaining a minimal change in melting point compared to an Sn-58Bi alloy. Another significant patent is for a semiconductor package using core material for reverse reflow. This package features a first bump pad on a first substrate, a second bump pad on a second substrate, and a core material for reverse reflow positioned between the two bump pads. The solder member forms a solder layer on the core material, ensuring effective contact with both bump pads.

Career Highlights

Jae Hun Song is currently employed at Mk Electron Co., Ltd., where he continues to develop innovative solutions in the electronics sector. His work has been instrumental in advancing the technology used in semiconductor packaging and soldering processes.

Collaborations

He collaborates with talented coworkers, including Young Woo Lee and Jeong Tak Moon, who contribute to the innovative environment at Mk Electron Co., Ltd.

Conclusion

Jae Hun Song's contributions to the field of electronics through his patents demonstrate his commitment to innovation and improvement in manufacturing processes. His work continues to influence the industry positively.