The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 09, 2024
Filed:
Oct. 04, 2022
Applicant:
MK Electron Co., Ltd., Yongin-si, KR;
Inventors:
Young Woo Lee, Gyeonggi-do, CN;
Seul Gi Lee, Yongin-si, KR;
Hui Joong Kim, Yongin-si, KR;
Jae Yool Son, Yongin-si, KR;
Jae Hun Song, Yongin-si, KR;
Jeong Tak Moon, Suwon-si, KR;
Assignee:
MK ELECTRON CO., LTD., , KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 35/26 (2006.01); C22C 12/00 (2006.01); C22C 13/02 (2006.01); B23K 20/00 (2006.01); B23K 101/36 (2006.01);
U.S. Cl.
CPC ...
B23K 35/264 (2013.01); B23K 35/262 (2013.01); C22C 12/00 (2013.01); C22C 13/02 (2013.01); B23K 20/00 (2013.01); B23K 2101/36 (2018.08);
Abstract
A lead-free solder alloy includes bismuth (Bi), content of which is equal to or greater than 56 wt % and equal to or less than 57.5 wt %, indium (In), content of which is equal to or greater than 0.05 wt % and equal to or less than 1.0 wt %, and the balance of tin (Sn) and another unavoidable impurity. The lead-free solder alloy of the disclosure may enable bonding with improved ductility and thermal shock reliability while not having a large melting point change compared to an Sn-58Bi alloy.