Hsinchu, Taiwan

Min-Shinn Feng

This inventor holds 4 USPTO granted patents. Top assignee: Winbond Electronics Corporation. Active years: 2000-2002.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Min-Shinn Feng. Retrieved from https://idiyas.com/inventor/min-shinn-feng

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 4

Forward Citations = 36(Granted Patents)


Company Filing History:


Years Active: 2000-2002

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4 patents (USPTO):Explore Patents

Title: Min-Shinn Feng: Innovator in Semiconductor Technology

Introduction

Min-Shinn Feng is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 4 patents. His innovative work focuses on enhancing the manufacturing processes and structural integrity of semiconductor devices.

Latest Patents

One of Min-Shinn Feng's latest patents is titled "Scribe line structure for preventing from damages thereof induced during fabrication." This invention provides a scribe line structure for semiconductor wafers, which includes a series of parallel horizontal and vertical scribe lines. These lines separate individual chips and are designed to relieve internal stress and prevent cracks during manufacturing. The multi-layer structure of the scribe lines includes cavities that help mitigate potential damage, ensuring the reliability of the semiconductor devices.

Another notable patent is the "STI process by method of in-situ multilayer dielectric deposition." This process outlines a method for forming shallow trench isolation (STI) structures. It involves several steps, including the deposition of composite silicon nitride on a silicon substrate, etching to create shallow trenches, and using chemical vapor deposition to fill these trenches with oxide layers. The method enhances the efficiency and effectiveness of STI structures in semiconductor fabrication.

Career Highlights

Min-Shinn Feng is currently employed at Winbond Electronics Corporation, where he continues to innovate in semiconductor technology. His work has significantly impacted the industry, particularly in improving manufacturing processes and device performance.

Collaborations

Throughout his career, Min-Shinn Feng has collaborated with notable colleagues, including Chi-Fa Lin and Wei-Tsu Tseng. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.

Conclusion

Min-Shinn Feng's contributions to semiconductor technology through his patents and collaborative efforts highlight his role as a key innovator in the field. His work not only advances manufacturing processes but also enhances the reliability of semiconductor devices.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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