Min Miao

Title: Min Miao: Innovator in Three-Dimensional Interconnected Structures

Introduction

Min Miao is a prominent inventor based in Beijing, China. He has made significant contributions to the field of microelectronics, particularly in the development of three-dimensional vertically interconnected structures. With a total of 2 patents, his work focuses on enhancing electrical interconnections and simplifying fabrication processes.

Latest Patents

Min Miao's latest patents include innovative methods for creating three-dimensional vertically interconnected structures. The first patent discloses a structure comprising at least two layers of chips stacked in sequence or face to face. An adhesive material is utilized for adhesion between adjacent layers, with each layer containing a substrate layer and a dielectric layer. The front surface of the chip features a first concave filled with metal, forming an electrical conductive ring that connects to microelectronic devices via a redistribution layer. This invention enhances electric interconnection and bonding between layers while simplifying the fabrication process and increasing yield.

The second patent also focuses on a three-dimensional vertically interconnected structure, detailing similar features as the first. It emphasizes the strength of electric interconnections and adhesion between layers, while the disclosed fabrication method aims to improve process efficiency and yield.

Career Highlights

Min Miao is affiliated with Peking University, where he continues to advance research in microelectronics. His innovative work has positioned him as a key figure in the development of advanced electronic structures.

Collaborations

Min Miao has collaborated with notable colleagues, including Shenglin Ma and Yunhui Zhu. Their combined expertise contributes to the ongoing research and development in their field.

Conclusion

Min Miao's contributions to the field of microelectronics through his patents on three-dimensional interconnected structures demonstrate his innovative spirit and commitment to advancing technology. His work not only enhances electrical interconnections but also simplifies manufacturing processes, paving the way for future advancements in the industry.