Hsinchu, Taiwan

Min-Hsuan Huang


Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2018-2019

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2 patents (USPTO):

Title: Innovations by Min-Hsuan Huang: Pioneering Interconnect Structures

Introduction

Min-Hsuan Huang, an accomplished inventor based in Hsinchu, Taiwan, has made significant contributions to the field of interconnect technology. With a total of two patents to his name, Huang’s innovations demonstrate a keen understanding of advanced fabrication methods. His work is instrumental in enhancing the functionality and efficiency of electronic devices.

Latest Patents

Huang's latest patents focus on innovative interconnect structures and their fabrication methods. The first patent describes an interconnect structure comprising a substrate and a conductive pattern. This conductive pattern features a bottom portion that is precisely positioned on the substrate and includes notches on each sidewall, enabling improved performance and reliability. The second patent elaborates on a more complex interconnect design that incorporates a substrate, a dielectric layer, a first conductive pattern, and a second conductive pattern. The dielectric layer is strategically placed over the substrate, containing an opening that houses the first conductive pattern. The second conductive pattern is then positioned on top of the first, revealing an exposed portion that also includes a notch, promoting better integration and functionality.

Career Highlights

Huang is currently associated with Macronix International Co., Ltd., a prominent player in the semiconductor industry. His role in the company allows him to further explore and develop cutting-edge technologies that contribute to the advancement of electronic components and systems.

Collaborations

One of Huang's notable colleagues is Hong-Ji Lee, with whom he collaborates on various projects. Their teamwork illustrates the importance of collaboration in the research and development of innovative solutions within the technology sector.

Conclusion

Min-Hsuan Huang's contributions to the field of interconnect structures reflect a blend of creativity, technical expertise, and a commitment to innovation. His patents not only pave the way for advancements in electronic design but also exemplify the collaborative spirit found in progressive technological environments. As the industry evolves, Huang's work will undoubtedly play a crucial role in shaping the future of electronic devices.

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