The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 20, 2018
Filed:
Jan. 24, 2017
Applicant:
Macronix International Co., Ltd., Hsinchu, TW;
Inventors:
Hong-Ji Lee, Hsinchu, TW;
Min-Hsuan Huang, Hsinchu, TW;
Assignee:
MACRONIX International Co., Ltd., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/52 (2006.01); H01L 21/768 (2006.01); H01L 23/522 (2006.01); H01L 23/528 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76883 (2013.01); H01L 21/76865 (2013.01); H01L 23/528 (2013.01); H01L 23/5226 (2013.01); H01L 23/53223 (2013.01); H01L 23/53266 (2013.01);
Abstract
An interconnect structure including a substrate, a dielectric layer, a first conductive pattern, and a second conductive pattern is provided. The dielectric layer is disposed on the substrate and has an opening. The first conductive pattern is disposed in the opening. The second conductive pattern is disposed on the first conductive pattern and exposes an exposed portion of the first conductive pattern. The exposed portion of the first conductive pattern has a notch.