Company Filing History:
Years Active: 2004-2009
Title: Innovations by Milan Djukic
Introduction
Milan Djukic is an accomplished inventor based in Gilbert, AZ (US). He has made significant contributions to the field of electronic assemblies and systems, particularly in the development of high yield, high reliability flip-chip integrated circuit (IC) packages. With a total of 3 patents, his work has advanced the technology used in electronic packaging.
Latest Patents
Milan Djukic's latest patents focus on electronic assemblies with filled no-flow underfill. These innovations utilize a combination of heat and pressure to bond flip-chip die and cure no-flow underfill material. The underfill comprises a filler or low coefficient of thermal expansion (CTE) material, which decreases the CTE of the cured underfill. The filler material can be selected from a variety of substances, including silica, silicon oxide, silicon dioxide, silicon nitride, aluminum oxide, and aluminum nitride. Additionally, the filler material may enhance the viscosity of the uncured underfill and increase the modulus of elasticity of the cured underfill. In some method embodiments, a thermocompression bonder is employed to simultaneously provide solder bump reflow and underfill curing. Various applications of these methods to component packages, electronic assemblies, and electronic systems are also described in his patents.
Career Highlights
Milan Djukic has built a successful career at Intel Corporation, where he has been instrumental in advancing electronic packaging technologies. His expertise in the field has led to the development of innovative solutions that enhance the reliability and performance of electronic devices.
Collaborations
Milan has collaborated with notable coworkers, including Song-Hua Shi and Carlos A Gonzalez. Their combined efforts have contributed to the success of various projects within the company.
Conclusion
Milan Djukic's contributions to the field of electronic assemblies and systems have made a significant impact on the industry. His innovative patents and work at Intel Corporation highlight his role as a leading inventor in the field.